• iMx6 CortexTM A9 MPCORETM
• iMX6 Solo, Dual Lite, Dual e Quad Cores x 1,2,4
• 4 to 64Gb eMMC
• NOR SPI 16Mbyte
• VPU1080p30 H. 264 Decode
• 2D/3D Graphics Acceleration X1
• 4x USB Host / Device 2 externals 2 internals
• 2x UART
• 2x I2C
• mSATA,RTC,PCIe,CAN,Ethernet,GPIOs x 30
• 1x CSI-2
• 1x CSI parallel
• Power supply: 12VDC
• Linux, Android,Ubuntu
• Size:102 x 146 mm
• Commercial temperature (0° a 70°)
• Extended temperature (-20° a 70°)
• Industrial temperature (-40° a 85°)
• Longevity:2030

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• Processor IMX6 Solo, DL, Dual Quad
• Up to 32GB eMMC
• SPI
• 5x UART
• 2x USB
• 2x CAN
• PWM
• 1x Ethernet 10/100/1000 Mbit/s
• IIS, SPI, IIC, LCD, SD, up to 7x GPIOs,1xCSI,2x CPI,PCIe,SDIOx2
• Temp 0° to 70° C or -40° to 85° C
• Minimum   Availability > 2022
• Linux and Android supported
• Dimensions (W x L x H) 67,6 mm x 45 mm
• Linux and Yocto

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• Provides all necessary connections for Bluetooth (CSR8311A08), WiFi (CSR6030), and GPS (UBX- G7020) including on board ceramic antennas for each IC
• UART to USB converter for the i.MX6 debug console port
• 4-port USB 3.0 chip (TUSB7430) with all necessary components
• Supports LCD, via LVDS, with resistance touch screen. All necessary backlight and LCD gamma voltages are generated.
• A NXP UDA1334ATS provides an audio out option. The electronics can directly drive headphones or can be used as an input to power speakers.

• FirstView SOM Interface
• 10 to 24VDC Supply Voltage
• Bluetooth, WiFi, and GPS
• USB 2.0 Host x1, 3.0 Host x 4, OTG x1
• 10/100/1000 Ethernet
• Analog Camera Interface
• LCD Interface with Touchscreen
• CAN Interface
• Console Debug Port (USB)
• User Defined Switches
• Audio Out and Microphone In
• 5 x 7.6 inches (127 x 193 mm)

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• i.MX 6Solo, 6DualLite, 6Dual, 6Quad (800 MHz DualLite default) processor options
• Automotive grade processor and components for harsh high temperature environments
• Multiple boot options; SPI NOR, eMMC, or Micro SD
• Full standalone operation. All needed connections for operation are on the board. Standalone items to be unpopulated for production to reduce manufacturing cost.
• Debug board interface for ease of development
• Keyed edge connector and multiple mechanical mounting holes for secure installation in harsh environments

• Freescale i.MX 6 Series ARM Cortex-A9 Processor
• Single 4.5V to 12VDC Supply Voltage
• 1GB DDR3 (expandable to 4GB)
• SPI NOR, eMMC, MicroSD
• 10/100/1000 Ethernet
• USB 2.0 Host and OTG
• SATA, PCIe, LVDs, FlexCAN, HDMI, I2C, SPI, CAN,
  RGB, Audio, UARTs, JTAG
• Edge Connector (MXM)
• 3.35 x 3.35 inches (85 x 85 mm)
• -40 to +85°C operational range
• Android and Linux Compatible

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• Processor IMX8M Mini Solo,Dual Quad
• ARM Cortex-M4 Real Time Processor at 400MHz
• Up to 128Gbyte eMMC 5.1
• Up to 4Gbyte DDR4
• 3x UART
• 1x DBG UART
• 1x PCIe
• PWM
• Watchdog
• 5x USB
• 2x CAN
• 2x LVDS, 1xDP, 1X DSI
• 1x Ethernet 10/100/1000 Mbit/s
• IIS/SAI, SPI, IIC, LCD, SD, up to 87x GPIOs
• Temp 0° to 70° C or -40° to 85° C
• 82 x 50 mm
• Longevity 10-15 Years
• Linux, Yocto and Android supported
• Industrial: Operating: -40 to +85°C Storage:-40 to +85°C
• Commercial: Operating: 0 to +60°C Storage: -40 to +85°C

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• Arm® Core 4 X Cortex-A35, 1 X Cortex-M4F
• DSP Core Tensilica® HiFi 4 DSP
• DRAM 8GB DDR3L Memory, 933MHz
• eMMC 4GB or 8GB ver 5.0 (HS400)
• GPU 1 x GC7000Lite Performance Optimized
• VPU 4K h.265 dec, 1080p h.264 enc/dec
• Gigabit Ethernet with RGMII
• Wi-Fi/BT Module SX-SDMAC-2832S+
• USB with PHY 1 x USB 3.0 (can be used as USB 2.0)
• 1 x USB 2.0
• 3xUART
• SPI, MIPI_CSI, PCIe, DISP, QSPIA&B
• 5x ADC,CSI,4x SAI
• 2x LVDS
• 4x PWM
• 3x CAN
• Size 85X 85mm
• Temperature -40° to +125° C
• Linux, Android

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• Arm® Core 4 X Cortex-A35, 1 X Cortex-M4F
• DSP Core Tensilica® HiFi 4 DSP
• Up to 8GByte onboard LPDDR4 Memory @4000MT/s
• eMMC 5.1 up to 128 GByte with HS400 compliance
• GPU 1 x GC7000Lite Performance Optimized
• VPU 4K h.265 dec, 1080p h.264 enc/dec
• Gigabit Ethernet with RGMII
• 5 X USB3.0 and USB 2.0,
• 1 x PCIe 2.0
• Up to 5 x UART
• 2 x SDIO 3.0
• 6 x I2c Bus
• 4 x SPI, QSPIA&B
• 1 x MIPI_CSI
• 1 x MIPI_DSI to HDMI
• 2x LVDS 0,1
• 4x PWM
• 2 x CAN
• Linux, Android, Windows, Yocto
• Form Factor:82 x 50 mm
• Temperature -40° to +125° C
• Extended longevity: up to 15 years

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• Arm® Cortex ®-A53 processor with speed up to 1.8 GHz
• Two camera inputs and Image Signal Processor (ISP) HDR-capable of 375 MPixels/s.
• x16/x32 LPDDR4/DDR4(Inline ECC), Up to 6GByte onboard LPDDR4
• memory @ 4000 MT/s.
• eMMC 5.1 up to 128 GByte with HS400 compliance, Dual-ch QuadSPI.
• Advanced multimedia capabilities include 1080p60 video encode and decode H.265 and H.264.
• 3D and 2D graphic acceleration supporting GC7000UL (2 shaders), OpenGL ES 1.1/2.0/3.0/3.1, Open VG 1.1, Vulkan, OpenCL 1.2; GC520L (2D).
• 1x Giga bit Ethernet,5 X USB3.0 and USB 2.0, 4 x UART.
• 1x PCIe3.0, 3 x SDIO 3.0, 3 x I2C Bus, 2 x SPI.
• 1x HDMI 2.0a Tx, 2x FlexCAN, PWM,6 x SAI, 5 x GPIOs.
• 2 x LVDS 0,1,2 x I2S ,2 x MIPI CSI, uSDHC2, 1x RGMII.
• Software: Linux, Android, Yocto
• Temperature
  • Commercial: Operating: 0 to +60°C, Storage: -40 to +85°C
  • Industrial: Operating: -40 to +85°C, Storage: -40 to +85°C
• Extended longevity: up to 15 years
• Form Factor:82 x 50 mm

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